29th International Symposium on Dry Process (DPS 2007)
November 13-14, 2007
Tokyo International Exchange Center, Plaza Heisei, Aomi, Koto-ku, Tokyo JAPAN
URL: http://www.DPS2007.org Sponsored by:
The Institute of Electrical Engineers of Japan
Co-Sponsored by:
The Japan Society of Applied Physics
In conjunction with:
The Institute of Electronics, Information and Communication Engineers of Japan
The Korean Institute of Surface Engineering, The Korean Vacuum Society
The Electrochemical Society of Japan, Electrochemical Society Japan Chapter Dry processes are the state of the art technologies leading the way through ultra-high performance in microelectronic devices. The DPS provides for 28 years a valuable forum of discussions on science and technology of new developments in this field. Present 29th symposium is to be held in Tokyo, Japan. A special issue of “Japanese Journal of Applied Physics” will be published besides the Extended Abstracts. The DPS Organizing Committee invites you to the conference and welcomes the submission of your papers. General Topics and Arranged Session:
Theme:
Dry processes and related technologies from fundamentals to applications
Topics:
Mechanisms of plasma-induced surface reactions / Diagnostics and monitoring of plasmas and reaction surfaces / Damages induced by photon-, electron-, and ion-irradiation onto surface / Surface reactions of wet process (cleaning, CMP, electroplating) / Process technologies for etching, CVD and surface treatment / Dry process for low-k, high-k, and new materials / MEMS technologies / Process technologies for flat panel display (LCD, PDP, Organic ELD) / Nanotechnologies and bio-applications / Environmental technologies / Equipment technology for dry processes / New dry process concept (micro-plasmas, atmospheric plasmas, etc). Arranged Session:
‘Etching mechanism in relation to the condition of film and mask deposition’ Submission of Extended Abstracts:
Two page (A4) camera-ready abstract, including figures and references, should be submitted by July 22, 2007. After the reviewing process, authors will be notified of acceptance or rejection of their abstracts by September 7, 2007. Based on scientific quality the Program Committee will select about 25 papers for oral presentation. Accepted contributions will appear on the DPS 2007 Extended Abstract. Special Issue of “Japanese Journal of Applied Physics (JJAP)”
All participants willing to submit papers to the special issue should hand in the manuscripts at the registration desk on the first day of the symposium. All manuscripts will be reviewed by standard procedures of peer-review. The accepted papers will be published in a special issue of “JJAP”. Invited Speakers:
N. Boutroy (Sidel Group) "DLC coating in inner wall of PET bottle using microwave discharges"
J. G. Eden (U. of Illinois) "Arrays of microcavity plasma devices"
D. B. Graves (UC Berkeley) "Energetic ion and radical beam interaction with photoresist polymers"
J. Kido (Yamagata University) "Fabrication of High Performance Organic Light-Emitting Devices"
E. Sardella (U. of Bari) "Plasma aided micro- and nano-patterning"
A.Yamaguchi (Hitachi) "Metrology of LER/LWR: Impact on Device Performance"
Y. Zhang (IBM) "Plasma etching of sub-10nm features by using self-assembled nano masks" Registration Fee:
The registration fee covers the Conference Abstracts with CD-ROM: Early registration (before September 28, 2007): 30,000 JPY for society member, 33,000 JPY for non-member and 8,000 JPY for student. Late registration: 35,000 JPY for society member, 38,000 JPY for non-member and 8,000 JPY for student. Secretariat –DPS 2007
Office Sofiel Fax: +81(Japan) 3-5821-7439
E-mail: secretary@dps2007.org
URL: http://www.dps2007.org | 
