Plasma Technology for Advanced Devices

05/03/07:

Self-assembled airgaps

04/01/2007:
Self-Aligned Double Patterning

03/10/2007:
Flash(y) Notebooks before end of 2007?

03/05/2007:
Graphene transistors

03/03/2007:
Intel 45nm transistor technology

02/28/2007:
IBM extends immersion lithography to 22nm

02/09/2007:
Micron announces 25nm flash device

02/05/2007:
AMD high k / metal gate

01/27/2007:
IBM announces high k metal gate for 45nm node

01/27/2007:
Intel announces high k / metal gate in 45nm Penryn processor

01/25/2007:
STM stops 32nm development

01/24/2007:
TI stops 32nm development

01/23/2007:
Freescale to join IBM alliance

01/05/2007:
Sandisk shows 32Gb SSD at CES2007

01/03/2007:
SAMSUNG announces 50 nm 16Gb floating gate NAND flash

01/01/2007:
45 to 32 nm: Another Evolutionary Transition

12/05/2006:
Metal Etch Redefined

09/11/2006:
SAMSUNG announces 32Gb Charge Trap Flash

10/30/2006:
First Announcement ICPIG 2007

09/11/2006:
Pre-registration CAPPSA 2007

09/08/2006:
Qimonda 58 nm dRAM

09/06/2006:
Quantum Dot Displays

09/05/2006:
EUV: Who gets the first tool ?

09/05/2006:
EUV: Who gets the first tool ?

08/16/2006:
Ballistic Transistors

07/26/2006:
SAMSUNG SSD

07/25/2006:
IMFT 50 nm NAND flash

06/15/2006:
IMEC FUSI Devices

04/30/2006:
DPS2006: First Announcement

06/12/2006:
TI 45 nm node

04/05/2006:
Nantero fabricates 22nm CNT based memory switch

03/28/2006:
AdvantEdge Etch: 90 and 70nm dRAM production

03/24/2006:
Carbon Nanotube based ring oscillator published by IBM

03/14/2006:
KAIST claims 3nm FinFET

02/19/2006:
IBM prints 30nm

02/08/2006:
Rollable OLED color display

01/31/2006:
Infineon with first 65 nm samples

01/28/2006:
Surface-Conduction Electron-Emitter Displays

01/21/2006:
New Family of Self-Assembling Nanolattices

01/12/2006:
IBM, Sony and Toshiba will collaborate on 32 nm

01/09/2006:
ITRS 2005 Edition

12/06/2005:
AdvantEdge Metal Etch for Flash and dRAM

12/05/2005:
Freescale introduces ITFET

11/21/2005:
Intel - Micron Flash Joint Venture

11/11/2005:
Plasma Display Panel Shortage in 2006

11/09/2005:
Toshiba and NEC collaboration on 45 nm System LSI Process Technologies

10/25/2005:
Fluidigm opens biochip plant in Singapore

10/21/2005:
Nature Podcast

10/15/2005:
First announcement and call for papers: ICMI 2006

10/15/2005:
3rd International Workshop on Microplasmas 2006

10/10/2005:
27th International Symposium on Dry Process (DPS 2005)

10/08/2005:
Micronic Introduces Sigma7500 Laser Pattern Generator

10/03/2005:
Hynix unveils roadmap for 70-nm NAND flash

10/02/2005:
Berkeley Nanofluidic Transistor

08/15/2005:
IBM/AMD to collaborate on 32 nm and below

06/18/2005:
Toshiba and SONY Introduce High k Deep Trench

07/12/2005:
AdvantEdge Etch Reduces Across Wafer CD variation

06/18/2005:
IBM on HOT Technology at VLSI Symposium

06/18/2005:
Breakthrough in Molecular Transistors

07/07/2005:
Dallas Semiconductor/Maxim Open House for Process Engineers 7/12-13

06/20/2005:
Jack Kilby dies at age 81

06/07/2005:
Second Announcement 58-th GEC San Jose

06/06/2005:
Call for papers: 8th Technical and Scientific Meeting of CREMSI

04/26/2005:
TSMC's 45 nm node possibly without high k

04/16/2005:
High k for 45 nm technology node ?

03/09/2005:
Physics and process drive etch performance at 45nm (SST)

03/08/2005:
TI delivers first 65nm device to wireless market (eeProduct Center)

03/06/2005:
Nanoelectronics: advanced devices at CEA/LETI

02/17/2005:
Intel publishes paper on continuous wave all-silicon laser (see also original paper in "Nature")

02/09/2005:
Line Edge Roughness is here to stay (Semiconductor International)

02/07/2005:
IBM, SONY, Toshiba disclose cell chip details

02/01/2005:
HP crossbar latch (see also J. Appl. Phys. Paper)

01/26/2005:
SOI based memory technology doubles memory density

01/24/2005:
IBM and Chartered announce 45 nm partnership

12/17/2004:
NEC Develops Transistor with New Metal Gate Electrode & High-K Gate Dielectric (JCN Network)

12/7/2004:
Transparent Transistors (Science News)

12/6/2004:
IBM announces "selective strained germanium" technology (IBM)

11/20/2004:
Infineon demonstrates carbon nanotube transistor with 18 nm gate length

11/8/2004:
Electric Field Modulation of Galvanomagnetic Properties of Mesoscopic Graphite (Arxiv)

11/8/2004:
Fabrication and Electric Field Dependent Transport Measurements of Mesoscopic Graphite Devices (Arxiv)

11/6/2004:
Small ideas for a big market (Electronic Business)

11/5/2004:
Memories may mark early beachhead for nanotech

10/14/2004:
Toshiba and Xilinx annouce strategic foundry relationship

9/26/2004:
Technology Innovations and Process Integration for Sub-100nm Gate Patterning

9/24/2004:
Rate Clarycon at www.science-search.org

9/12/2004:
Tungsten Silicide Gate Etch

9/11/2004:
Strained Silicon News by Physorg.com

8/22/2004:
"Plasma Etch Applications" Update: "Softlanding During Gate Etching"

7/24/2004:
"Principles of Semiconductor Devices" by Bart van Zeghbroeck

7/5/2004:
Plasma etch processes for ULSI semiconductor circuits / M. Armacost et al.

7/4/2004:
Start-ups addressing microprocessor power consumption / Deni Connor, Network World

7/3/2004:
"Plasma Etch Applications" Update: "Gate Oxide Integrity"

6/30/2004:
"Plasma Etch Applications" Update: "
Sidewall passivation layer formation during gate etch"

6/28/2004:
Plasmas and Plasma Processing by Paul May and Mike Ashfold, University of Bristol

6/18/2004:
Advanced etch applications using tool-level data / Andy Skumanich et al.

6/13/2004:
"Plasma Etch Applications" Update: "Influence of Mask Material in Silicon Gate Etching"

6/8/2004:
Call for papers : 7th Technical and Scientific Meeting of CREMSI

5/22/2004
Nanotechnologies at Infineon Research

5/14/2004
Surface Science Issues in Plasma Etching

5/10/2004
Philips proves first silicon from 90-nm CMOS production line

5/7/2004
Texas Instruments becomes core member of IMEC sub-45 nm CMOS research program

5/5/2004
Call for papers 26th International Symposium on Dry Process

5/4/2004
Bernie Meyerson / IBM: Scaling dead at 130 nm

4/29/2004
BinOptics Introduces 1310nm Horizontal-Cavity Surface-Emitting Laser

4/25/2004:
Challenges in Metal Gate Etching for Logic Applications

4/22/2004
CEA signs research contract with the partners of the Crolles2 Alliance for development of 45 nm and 32 nm CMOS nanoelectronic technologies

4/19/2004
Preview of the 2004 VLSI Symposium: High k, Metal Gates, Strained Silicon

4/17/2004
CEI-Europe presents Course on Plasma Etching for CMOS Technology and ULSI Applications

4/16/2004
Xerox Develops Semiconductive Ink

4/15/2004
The International Conference on IC Design and Technology in Austin: Forum for interaction and collaboration of IC design and technology

4/3/2004
Updated Links Page: Plasma Physics Research at UC Berkeley

4/2/2004
Zyvex announces IC probing application with 5 nm movement control

3/28/2004
Plasma Etch and Transistor Device Patents vol.17

3/8/2004
Nanotechnology Funding

3/3/2004
Literature Digest vol.16: Highlights of the 2004 SPIE Microlithography Symposium

3/1/2004
MIT, Stanford, UC Berkeley Nanotechnology Forum: The Future of Storing Bits

2/25/2004
Clarycon presents updated transistor device feature size and performance comparison

2/17/2004
Literature Digest vol.15: Highlights of the 2003 IEDM conference

2/15/2004
Plasma Etch and Transistor Device Patents vol.16

2/1/2004
"Smaller CDs Redefine Metrology" by Alexander E. Braun, Semiconductor International, February 2004

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